Composites

Epotec® Epoxy Resin Systems helps in solving many of design challenges in the pursuit of superior performance, weight savings, durability, meeting environmental resistance and cost effectiveness. Epotec® Composite Resin Systems are suited to address many design challenges in the pursuit of superior performance, weight savings, durability, adhering environmental standards and in ensuring cost effectiveness. They are designed to meet process requirements, such as Resin Transfer Molding (RTM), Resin Infusion ( RI ), Hand lay Up, Prepregs, Filament Winding, and Pultrusion and are recognized for windmill blades, sport goods, automobile, marine, aeronautics, defense, CNG cylinders, pipes and tubes of different shapes and sizes, civil and infrastructure, and industrial applications

Filament Winding & Pultrusion Systems

Epotec ®Resin and Curing Agent System for Filament Winding and Pultrusion are designed to meet process requirements such as low viscosity, long pot life, accelerated curing at elevated temperature. Epotec® Systems can suitably be applied for manufacture of pressure pipes, water and effluent, CNG storage cylinders, underground cable covers, storage and transportation tanks, tubes and pipes for defense, aeronautics, aerospace, and reverse osmosis.

Click on individual product to download the Technical Data Sheet 

Epotec System

Mix ratio1

Mix Viscosity2

Gel time3

Tg4

Features

YDL 535 / TH 7354

100 : 35

500 - 1,000

8 - 10

145 - 155

Low viscosity, long pot life system suitable to cure at ambient temperature, post curing above 120°C is required.

YDL 549 / TH 7664

100 : 90

400 - 800

>8

115 - 125

Elevated temperature curing system for designed for fast productivity. Excellent performance in cyclic loading conditions

YDL 582 / TH 7255

100 : 35

500 - 750

25 - 355

80 - 90

Low viscosity, fast, ambient cure system for small components.

YDL 582 / TH 7256

100 : 35

500 - 650

80 - 1005

80 - 90

Ambient temperature cure, low viscosity system for small components with medium reactivity.

YDL 582 / TH 7257

100 : 35

200 - 500

4.5 - 5.5

80 - 90

Ambient temperature cure, slow reactive system with very low viscosity for fairly large components.

YDL 598/ TH 7657/ TA 7852

100 : 85: 0.2 - 1.0

700 - 1000

> 10

75 - 85

Halogen free retardant system designed to cure at elevated temperatures

YDL 660 / TH 7455

100 : 25

1,500 - 3,500

> 16

170 - 200

Very slow reactive, ambient cure system for high glass transition temperature (Tg). Post curing required above 160°C.

YDL 670 / TH 7353

100 : 22

1,000 - 2,000

1 - 3

140 - 170

High temperature resistance, medium viscosity system for ambient curing, post curing above120°C is required to achieve full strength.

YDL 670 / TH 7354

100 : 35

500 - 1,000

8 - 10

140 - 170

Long pot life, high temperature resistant system. Post curing above 120°C is required.

YDL 680 / TH 7652 / TA 7851

100 : 80 : 1 - 2

500 - 1,000

> 10

130 - 160

Low viscosity, long pot life, elevated temperature cure system for high thermal resistance.

YDL 680 / TH 7661 / TA 7851

100: 90 : 0.5 - 3.0 

1,000 - 2,500

> 10

160 - 180

Low viscosity, long pot life, elevated temperature cure system for large components.

YDL 690 / TH 7661 / TA 7852

100 : 90 : 0.5 - 3.0

3,000 - 6,000

> 16

220 - 240

Very slow reactive, ambient cure system for excellent thermal resistance. Post curing above 200°C is required to achieve full strength.

1Part by Weight (pbw), 2 Brookfield Viscoisty @ 25°C (cPs), 3 Pot Life in Hours, @ 25°C 100 grams Mix, 4 Glass Transition Temperature (°C), 5 Pot Life in minutes, @ 25°C 100 grams Mix, 6 Brookfield Viscoisty @ 50°C (cPs),