Epotec® Epoxy Systems for composite applications are developed to suit the composite processing technique and the end application requirements. The product portfolio includes epoxy systems for : Pultrusion &Filament winding, Laminating resins for RTM, Hand lay-up & Infusion, Resins for making Prepregs, Expandable epoxy systems, Structural adhesive, Flexible epoxy systems and Surface Gel Coats.

Epotec® Prepreg Resin systems are solvent free systems which provide long shelf life at room temperature.These systems are suitable for wide variety of reinforcements and components of different dimensions.

Grade Mixing Ratio 1 Shelf Life 2 Tg 3 Action
YD 143 > 60 130 - 140
Features

Single component system, long shelf life at ambient conditions.

YD 565 / TH 7275 100: 25 > 15 115 - 125
Features

Low mix viscosity, solvent free system

YD 570 / TH 7252 100 : 20 > 30 115 - 125
Features

Moderate shelf life, solvent free system

1 Epoxy Equivalent Weight (grams / equivalent), 2 in days @ 25°C (cPs) ,3 Glass Transition Temperature (°C)

Epotec® Epoxy Systems for Filament Winding and Pultrusion are designed to provide ease of impregnation and fibre wetting. The systems include ambient as well as elevated temperature curing systems providing moderate to high thermal resistance.
 

Grade TFST 1 Mixing Ratio 2 Mix Viscosity 3 Pot Life 4 Action
YDL 535 / TH 7354 145 - 155 100 : 35 500 - 1000 8 - 10
Features

Low viscosity, long pot life system suitable to cure at ambient temperature, post curing above 120°C is required.

YDL 549 / TH 7664 115 - 155 100 : 90 400 - 800 8
Features

Elevated temperature curing system for designed for fast productivity. Excellent performance in cyclic loading conditions

YDL 582 / TH 7255 80 - 90 100 : 35 500 - 750 25 - 35
Features

Low viscosity, fast, ambient cure system for small components

YDL 582 / TH 7256 80 - 90 100 : 35 500 - 650 80 -100
Features

Ambient temperature cure, low viscosity system for small components with medium reactivity.

YDL 582/ TH 7257 80 - 90 100 : 35 200 - 500 4.5 - 5.5
Features

Ambient temperature cure, slow reactive system with very low viscosity for fairly large components.

YDL 598 / TH 7657 / TA 7852 75 - 85 100 : 85: 0.2 - 0.1 700 - 1000 > 10
Features

Halogen free retardant system designed to cure at elevated temperatures

YDL 660 / TH 7455 170 - 200 100 : 25 1500 - 3500 > 16
Features

Very slow reactive, ambient cure system for high glass transition temperature (Tg). Post curing required above 160°C.

YDL 670 / TH 7353 140 - 170 100 : 22 1000 - 2000 1 - 3
Features

High temperature resistance, medium viscosity system for ambient curing, post curing above120°C is required to achieve full strength.

YDL 670 / TH 7354 140 - 170 100 : 35 500 - 1000 8 - 10
Features

Long pot life, high temperature resistant system. Post curing above 120°C is required.

YDL 680 / TH 7652 / TA 7851 130 - 160 100 : 80 : 1 - 2 500 - 1000 > 10
Features

Low viscosity, long pot life, elevated temperature cure system for high thermal resistance.

YDL 680 / TH 7661 / TA 7851 160 - 180 100 : 90 : 0.5 - 3.0 1000 - 2500 > 10
Features

Low viscosity, long pot life, elevated temperature cure system for large components.

YDL 690 / TH 7661 / TA 7852 220 - 240 100 : 90 : 0.5 - 3.0 3000 - 6000 > 16
Features

Very slow reactive, ambient cure system for excellent thermal resistance. Post curing above 200°C is required to achieve full strength.

1Part by Weight (pbw), 2 Brookfield Viscoisty @ 25°C (cPs), 3 Pot Life in Hours, @ 25°C 100 grams Mix, 4 Glass Transition Temperature (°C), 5 Pot Life in minutes, @ 25°C 100 grams Mix, 6 Brookfield Viscoisty @ 50°C (cPs),

Epotec® laminating resin Systems for Resin transfer molding (RTM), hand lay-up and Infusion include ambient as well as elevated cure systems designed for optimum processing viscosity and reactivity varying from few minutes to several hours at ambient temperature. The choice can be made depending on process conditions, geometry of the component and end use requirements.

Grade Mixing Ratio 1 Tg 2 Mix Viscosity 3 Pot Life 4 Action
YD 535 / TH 7253 - 8 100 : 35 75 - 90 800 - 1400 8 (TH7253) - >10 (TH7258)
Features

One resin-six hardener system with fast to slow reactivity

YD 580C / TH 7253C - 8C 100 : 33 75 - 90 800 - 1400 8(TH 7253C) - >10 (TH 7258C)
Features

One resin-six hardener system with fast to slow reactivity, designed for fast strength built-up & high mechanical stiffness.

YD 535LV / TH 7253 - 8 100 : 35 0 - 0 200 - 300 8 (TH7253) - >10 (TH7258)
Features

One resin - six hardener system with fast to slow reactivity

YD 585 / TH 7255 - 7E 100 : 32 75 - 85 200 - 300 40 - 400
Features

One resin- two hardener system, fast hardener has low viscosity

YD 535SP/ TH 8257SP 100 : 34 75 - 85 200 - 300 > 10
Features

Slow reacting system, fast strength built-up in comparison to systems of similar reactivity

YD 535LC / TH 8258SP 100 : 32 80 - 90 220 - 230
Features

Slow reacting system. Suitable for large to extra large components, enables defect reduction in manufacturing.

YDL 579 / TH 8270 100 : 38 110 - 130 500 - 700 80 - 120
Features

Fast strength build-up with high thermal stability, excellent dynamic mechanical properties

YDL 535 / TH 7295 100 : 30 120 - 140 800 - 1500 120 - 140
Features

Low viscosity, slow reactive system for high thermal resistance and mechanical property retention at elevated temperatures

YDL 547 / TH 8278 100 : 25 80 - 90 600 - 1000 90 - 130
Features

Low viscosity ambient cure system for small components where high wetting and fast strength build-up is required.

YDL 586/ TH 8280-1 100 : 35 75 - 90 500 - 1000 12 - 60
Features

General purpose laminating system with one resin- two hardeners of different reactivity

YDL 660 / TH 7255 100 : 35 90 - 110 1000 - 1400 30 - 50
Features

Medium viscosity system for small components providing moderate thermal resistance.

YDL 583 / TH 8272 - 4 100 : 25 130 - 140 1000 - 2000 30 - 90
Features

One resin- two hardener system designed for fast productivity in manufacturing auto-components by RTM process.

YDL 567 / TH 8287 100 : 38 65 - 75 500 - 1000 50 - 70
Features

Clear, low colour laminating resin system with exceptional UV resistance

YD 510 / TH 7284 100 : 27 70 - 80 500 - 1000 45 - 55
Features

Laminating system designed exclusively for solar panels

YDL 660 / TH 7257 100: 35 90 - 110 500 - 1000 300 - 360
Features

Low viscosity, slow reactive system for FRP components with high ultimate elongation.

YDL 670 / TH 7652/ TA 7851 100 : 80 : 1 - 2 130 - 160 500 - 1000
Features

Elevated temperature cure, low viscosity standard system for good mechanical and thermal properties.

YDL 670 / TH 7661/ TA 7851 100 : 90 : 0.5 - 3.0 160 - 180 1000 - 2500
Features

Elevated temperature cure, low viscosity specialty system for excellent thermal and mechanical resistance at elevated temperature.

YDL 680 / TH 7354 100 : 35 130 - 180 2000 - 4000
Features

Medium viscosity, slow reactive, ambient cure system for excellent thermal resistance. Post curing above 140°C is required.

YD 595 / TH 7295 100 : 30 115 - 125 500 - 1000 210 - 240
Features

Laminating resin systems fro tooling & molds, provides moderate reactivity and temperature resistance

YD 5353LV/ TH 7353 100 : 25 130 - 140 350 - 400 150 - 200
Features

Laminating resin systems fro tooling & molds, provides moderate reactivity and temperature resistance

YDL 574 / TH 7363 100 : 30 115 - 125 250 - 300 380 - 420
Features

Laminating resin systems for tooling & molds by infusion process (<20 m)

YDL 594 / TH 7365 100 : 35 115 - 125 200 - 300 380 - 420
Features

Laminating resin systems for tooling & molds by infusion process (>20 m)

1 Part by weight (pbw), 2 Brookfield Viscosity @ 25°C (cP), 3 Pot life in minutes @ 25°C (100 grams mix), 4 Glass Transition Temperature (°C), 5 Pot life in hours @ 25°C (100 grams mix), 6 Potlife in hours @ 40°C (100 grams mix)

Epotec® Surface / Gel Coat Systems are designed to provide optimum tack free time and excellent surface finish after curing process.

Grade TFST 1 Mixing Ratio 2 Tg 3 Action
YDGC 1651 / TH 8266 2 - 3 100 : 45 65 - 75
Features

Clear, moderate reactivity

YDGC 1651 / TH 8267 4 - 5 100 : 45 65 - 75
Features

Clear, slow reactivity

YDGC 1652 / TH 8268 1 - 2 100 : 15 125 - 135
Features

Fast reactivity - designed for repair applications

YDGC 1653 e/ TH 8269 2 - 3 100 : 40 80 - 90
Features

Cyclo-aliphatic, moderate reactivity and temperature resistance

1 Part by weight (pbw), 2 in days @ 25°C , 3 Glass Transition Temperature (°C)

Epotec® Epoxy Adhesive Systems are designed to join various similar and dissimilar substrates providing excellent adhesion over wide range of service conditions. Specialized characteristics such as thixotropy, high temperature non-sag/slump resistant make them useful for applications in windmill blades and other structural composite applications

Grade Appearance 1 Mixing Ratio 2 Tg 3 Application 4 Action
YD 1535G / TH 7254G Thixotropic paste 100 : 45 75 - 85
Features

Fast curing adhesive for repair applications

YD 1535G / TH 7256G Thixotropic paste 100 : 45 75 - 85
Features

Moderately reactive adhesive for small to medium size components

YD 1535G / TH 7257G Thixotropic paste 100 : 45 75 - 85
Features

Slow reacting toughened system for main shell bonding, designed for fast strength built-up

YD 1581 / TH 9281 Thixotropic paste 100 : 45 75 - 85
Features

New generation bonding paste based on novel instant thixotropy concept. Designed foR improved machine dispensability and defect reduction

1 Part by weight (pbw), 2 in days @ 25°C , 3 Glass Transition Temperature (°C)

Epotec® Expandable Epoxy systems are suitable as core materials for light weight, rigid and dimensionally stable components starting from prototypes to bulk production.
 

Grade Mixing Ratio 1 Tg 2 Foaming time 3 Cured Density (kg/m3) 4 Action
YD 1107D130..D150 / TH 7152 100 : 25 100 - 110 15 - 20 130 - 150
Features

Closed cell in-situ non CFC foam system with density 130-700kg/m3

YD 1100 / TH 7152 100 : 27 80 - 90 15 - 20 180 - 220
Features

Closed cell in-situ non CFC foam system with density 130-700kg/m3

YD 1106D250...D350/ TH 7161 100 : 40 85 - 95 20 - 30 250 - 500
Features

Closed cell in-situ non CFC foam system with density 130-700kg/m3

YD 1106D600 / TH 7161 100 : 40 85 - 95 10 - 30 600 - 700
Features

Closed cell in-situ non CFC foam system with density 130-700kg/m3

1 Part by weight (pbw), 2 in days @ 25°C , 3 Glass Transition Temperature (°C)

Epotec® Flexible epoxy systems can be used for wide ranging applications such as decoratives- souvenir & labels, mold & patterns for RCC and PU components and to impart resilience to rigid structural components.
 

Grade Mixing Ratio 1 Mix Viscosity 2 Pot Life 3 Action
YD 135/ TH 7202 100 : 10 1500 - 2000 15 - 20
Features

Fast curing system providing flexibility at lower thickness

YD 135/ TH 8279 100 : 33 1500 - 2000 15 - 25
Features

Low color, blush-free system with good flexibility

YD 135 / TH 7273 100 : 33 3000 - 4000 10 - 15
Features

Slow curing system with excellent flexibility at higher thickness

1 Part by weight (pbw), 2 Brookfield Viscosity @ 25°C (cP), 3 Pot life in minutes @ 25°C (100 grams mix)