Epotec® Epoxy Systems are best known for casting into molds, cavities, cores and patterns. They are also extensively used for encapsulation, impregnation and protection of electrical and electronic assemblies and components. Usually low-pressure-reacted resins are utilized and curing is performed at room temperature to elevated temperature, up to 200°C. Room temperature curing Epotec® Systems are preferred for low voltage, small components, while heat-cured Epotec® Systems offer extremely high physical, thermal and chemical resistance. As such, heat-cured Epotec® Systems are used for medium and high voltage applications.

Grade Mixing Ratio 1 Tg 2 Mix Viscosity 3 Pot Life 4 Processing Temperature 5 Action
YDC6001 / TH7656 / Filler 100 : 30 : 200 110 - 120 1900 - 1900 6 - 8 / 120 120
Features

Semisolid resin and solid hardener system , provides low viscosity at elevated temperature. Suitable for high voltage and medium voltage applications

YDC6003 /TH7658SP / Filler 100 : 80 : 270 105 - 125 6800 - 6800 2.5 - 4.0 / 80 80
Features

Modified resin and hardener system, suitable for high voltage and medium voltage applications.Thermal Class H

YDC6003 /TH7662 / Filler 100 : 80 : 270 90 - 105 10000 - 10000 80
Features

Modified resin and hardener system. Suitable for high voltage and medium voltage applications .

YDC 6004 / TH7657/ TA7851_2/ TP01 (optional)/ Filler 100 : 100 : 1 : 10 : 410 90 - 100 1500 - 1500 20 - 25 / 25 80
Features

Modified resin and hardener system with tunable reactivity and flexibility. Preferred for medium voltage applications. Thermal Class F.

YDC6005 / TH7651/ TA7851/ TP03 (optional) / Filler 100 : 85 : 1 : 20 : 385 70 - 80 10000 - 10000 1 - 2 / 80 60
Features

Modified resin and hardener system suitable for high thermal shock resistance. Tunable reactivity and flexibility. Preferred for high voltage and medium voltage applications. Thermal Class H.

1 Part by Weight (pbw), 2 Brookfield viscosity cPs /80 °C, 3 Pot life in Hours for 5 kgs. mix  / °C, 4 Glass Transition Temperature (°C)

Grade Mixing Ratio 1 Tg 2 Mix Viscosity 3 Pot Life 4 Action
YDC6003 /TH7658SP / Filler 100 : 80 : 270 105 - 125 6800 - 6800 2.5 - 4.0 / 80
Features

Modified resin and hardener system, suitable for high voltage and medium voltage applications. Thermal Class H.

YDC6005 / TH7651 / TA7851/ TP01(optional)/ Filler 100 : 85 : 1 : 20 : 385 70 - 80 10000 - 10000 1 - 2 / 80
Features

Modified resin and hardener system suitable for high thermal shock resistance. Tunable reactivity and flexibility. Preferred for high voltage and medium voltage applications. Thermal Class H.

YDC6015/TH7652P1/ TP01(optional)/ Filler 100 : 80 : 7 : 350 90 - 100 10000 - 10000 1 - 2 / 80
Features

Modified resin and pre-accelerated hardener system with optional flexibilizer. Suitable for medium and high voltage applications. Thermal Class F.

YDC6030/TH7670/ TA7854/ Filler 100 : 82 : 0.5 : 270 85 - 95 1700 - 1700 1 - 2 / 80
Features

Modified toughened system with high thermal crack resistance. Suitable for medium and high voltage applications. Thermal Class H.

1 Part by Weight (pbw), 2 Brookfield viscosity cPs /80 °C, 3 Pot life in Hours for 5 kgs. mix  / °C, 4 Glass Transition Temperature (°C)

Grade Mixing Ratio 1 Tg 2 Mix Viscosity 3 Pot Life 4 Action
YDH184 / TH7351 / TA7851/ Filler 100 : 90 : 0.5 : 300 90 - 100 1000 - 1000 1 - 1.5 / 80
Features

Cycloaliphatic resin and hardener system with outstanding UV resistance and weatherability.

YDH184 / TH7356 / TA7851/ Filler 100 : 90 : 0.5 : 300 90 - 100 1000 - 1000 1 - 1.5 / 80
Features

Cycloaliphatic resin and hardener system. Provides handling and processing advantage due to liquid hardener .Outstanding UV resistance and weatherability.

YDH184M1 / TH7356P / Filler 100 : 80 : 300 75 - 85 500 - 500 1 - 1.5 / 80
Features

Modified-Toughened Cycloaliphatic epoxy system with pre-accelerated hardener.

YDH184 / TH7674 / TA7851/ Filler 100 : 95 : 1 : 300 105 - 115 1200 - 1200 1 - 1.5 / 80
Features

Novel Hydrophobic Cycloaliphatic resin and hardener system with outstanding UV resistance and self healing behavior.

YDCW 6032 / TH 7370P 100 : 20 70 - 75 750 - 750 1 - 1.5 / 80
Features

Prefilled – Pre accelerated toughened system with optimized formulation for improved filler anti-setting

1 Part by Weight (pbw), 2 Brookfield viscosity cPs / 80°C, 3 Pot life in Hours for 5 kgs. mix  / °C, 4 Glass Transition Temperature (°C)

Grade Mixing Ratio 1 Tg 2 Mix Viscosity 3 Pot Life 4 Processing Temperature 5 Action
YDC 6029/TH7668P 100:30 105 - 120 3000 - 3000 1 - 1.5 / 80 80
Features

Elevated cure resin system designed to provide high temperature resistance. Meets UL 94 V0 (6mm) requirement

YDC6033 / TH8286 _ 7 100 : 25 110 - 120 250 - 250 0.5 - 1.5 / 25 (100 gms) 25
Features

One resin-two hardener room temperature curing system designed exclusively for LV busbar application (Marten’s HDT >120C)

YDC6034 / TH7269 100:10 60 - 70 700 - 700 1.5-2.0/25 (100gms) 25
Features

Room temperature cure modified resin system. Complies with EU and RoHS.

YDC 6018 / TH 8251 100 : 18 60 - 70 5000 - 5000 0.4 – 0.6/25 (100 gms) 25
Features

Expandable epoxy system with cured density 0.70 – 0.80 gm /cc. Recommended for potting of electronic components.

1 Part by Weight (pbw), 2 Brookfield viscosity cPs / °C, 3 Pot life in Hours for 5 kgs. mix  / °C, 4 Glass Transition Temperature (°C), Differential Scanning Calorimeter (DSC)